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"Layer F.Cu" "Notes": "Layers L1/L2" "Notes": "Layer F.Cu" "Notes": "Layers L1/L2" "Notes": "Layer F.Cu" "Notes": "Layers L1/L2" "Notes": "Layer B.Paste" "Notes": "Layer B.Paste" "Notes": "Layer B.Mask" "Notes": "Layer F.Cu" "Notes": "Layers L1/L2" "Notes": "Layer B.Mask" "Notes": "Layer F.Paste" "Notes": "Layer F.SilkS" "Notes": "Layer B.Paste" "Notes": "Layer B.SilkS" ; DRILL file {KiCad 7.0.11-7.0.11~ubuntu22.04.1} date Tue Mar 5 20:19:51 2024 Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes T5 15.200mm 0.5984" (1 hole T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes) T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) T5 15.200mm 0.5984" (1 hole T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole Total plated holes count 16 Not plated through holes: merged pull request 'Fix rail clearance issues, make all power traces large From 56529bef3a0c7d0b31cfccd6b6ce971fb35b4e9c Mon Sep 17 00:00:00 2001 .../Panels/UNSEEN SERVANT.png | Bin 0 -> 11916 bytes .../Panels/MIRROR IMAGE.png | Bin 38860 -> 0 bytes Latest commits for file Docs/precadsr_layout_front.pdf Panels/dual_vca.scad Normal file View File 54fe483060 Delete '3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/COLOR SPRAY.png Normal file View File 3D Printing/Pot_Knobs/18-spline-pot-knob-no-indicator-line.stl Executable file View File 3D Printing/Cases/Eurorack Modular Case/EuroRack_Case_26.png Executable file Unescape Hardware/PCB/precadsr/ao_tht.pretty/TerminalBlock_dinkle_pluggable_2_P5.00mm.kicad_mod Normal file View File 3D Printing/AD&D 1e.

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