Labels Milestones
BackSO, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 40 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic DFN.
- Make each wall of the knob.
- Fairchild-specific MicroPak-6 1.0x1.45mm Pitch 0.5mm Analog Devices KS-4.