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Pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition Appendix A BGA 238 0.5 CPG238 Spartan-7 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition Appendix A BGA 484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=265, NSMD pad definition Appendix A BGA 1156 1 FF1156 FFG1156 FFV1156 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, YZP, YZP0010, 1.86x1.36mm, 10 Ball, 3x4 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/dac80508.pdf Analog LFCSP, 16 Pin (http://www.thatcorp.com/datashts/THAT_1580_Datasheet.pdf), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 43045-1400 (alternative finishes: 43045-200x), 10 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, 42819-62XX, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST ZE series connector, B02B-ZESK-1D, with boss (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-116-02-xx-DV-TE, 16 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Inductor SMD 0201 (0603 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for a short time before it actually gets removed, it CANNOT be undone in most cases. Continue? D952ec97f3 Merge issues to be severed. WARNING: There is a little bit of margin // Width of module (HP) width = 10; // [1:1:84] fm_in = [h_margin+working_width/8, row_2, 0]; fm_lvl = [second_col, fifth_row, 0]; square_out = [output_column, row_2, 0]; fm_lvl = [second_col, third_row, 0]; //Fourth row interface placement pwm_in = [first_col, fifth_row, 0]; square_out = [output_column, bottom_row, 0]; cv_in = [input_column, row_2, 0]; fm_in = [h_margin+working_width/8, row_3, 0]; pwm_duty = [width_mm - h_margin - working_width/8, row_3, 0]; cv_in_2b = [right_col, row_3, 0]; manual_2 = [left_col, row_2, 0]; cv_2b_atten = [right_col, row_1, 0]; fm_in = [input_column + h_margin/2, row_1, 0]; pwm_in = [input_column + h_margin/2, bottom_row, 0]; pwm_pot = [input_column - h_margin/2, bottom_row, 0]; cv_in = [h_margin, row_1, 0]; right_rib_x = width_mm - h_margin; cv_in = [input_column, bottom_row, 0]; c_tune = [second_col, third_row, 0]; fm_lvl = [h_margin+working_width/8, row_2, 0]; pwm_in = [input_column + h_margin/2, bottom_row, 0]; pwm_duty = [second_col, fifth_row, 0]; square_out = [third_col, third_row, 0]; saw_out = [output_column, row_2, 0]; fm_in = [input_column + h_margin/2, bottom_row, 0]; pwm_pot = [input_column + h_margin/2, row_1, 0]; square_out = [third_col, fifth_row, 0]; pwm_duty = [input_column, row_2, 0]; square_out = [output_column, row_2, 0]; fm_lvl = [h_margin+working_width/8, row_4, 0]; pwm_cv_lvl = [width_mm - h_margin.

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