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SoC Radio ANT Bluetooth BLE D52 nRF52 Garmin Canada Dynastream Nordic Low Power Long Range Transceiver Module THT-16 (https://www.hoperf.com/data/upload/portal/20181127/5bfcbea20e9ef.pdf Low Power Long Range Transceiver Module LoRa Radio, RF, Module, http://www.hoperf.com/upload/rf/RFM69HW-V1.3.pdf 8 pin package (http://datasheet.octopart.com/ZDT6758TA-Zetex-datasheet-68057.pdf Diodes Incorporated PowerDI3333-8, Plastic Dual Flat No Lead Package, 1.2x1.8x1.55 mm Body [LFCSP]; (see https://www.intersil.com/content/dam/Intersil/documents/l72_/l72.10x10c.pdf LFCSP VQ, 24 pin, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (SO), see https://www.elpro.org/de/index.php?controller=attachment&id_attachment=339 SO, 4 Pin (https://ww1.microchip.com/downloads/en/DeviceDoc/DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf), generated with kicad-footprint-generator Hirose series connector, B18B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-113-02-xxx-DV-BE-LC, 13 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-131-02-xxx-DV, 31 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip Type FFC/FPC, 502250-3391, 33 Circuits (http://www.molex.com/pdm_docs/sd/5022503391_sd.pdf), generated with kicad-footprint-generator Harting har-flexicon series connector, 505405-0370 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=283), generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-30DS-0.5V, 30 Pins (http://www.molex.com/pdm_docs/sd/529910308_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0730, 7 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41792-0009 example for new mpn: 39-28-x18x, 9 Pins (http://www.molex.com/pdm_docs/sd/559350530_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 4-Lead Plastic Small Outline Narrow Body Body [QSOP] (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body (http://www.ti.com/lit/ml/msop002a/msop002a.pdf SOIC, 16 Pin (https://www.ti.com/lit/ml/msop002a/msop002a.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1130, 11 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog&lang=en&documentid=D31688_en), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 4 times 0.127 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Mounting Hardware, external M3, height 12, Wuerth electronics 9774030243 (https://katalog.we-online.de/em/datasheet/9774030243.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py PowerPAK 1212-8 Single Zetex, SMD, 8 pin DIP socket A-001 1 14 pin connector, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F215079%7FY1%7Fpdf%7FEnglish%7FENG_CD_215079_Y1.pdf%7F215079-4 connector TE-Connectivity Micro-MaTch female-on-board top-entry thru-hole 4 pin straight chassis connector Dual front isolated BNC plug (https://www.winconn.com/wp-content/uploads/364A2595.pdf Dual BNC Horizontal Isolated Subminiature Coaxial Switch 1.35mm High, DC to 11GHz Molex MMCX Coaxial.

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