Labels Milestones

Back

20-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils 24-lead surface-mounted (SMD.

• Definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.5mm Pitch.
• Circuit case CD542, Land pattern PL-094, pads.

New Pull Request

0 Open 0 Closed

Label

Show archived labels

Use alt + click/enter to exclude labels

All labels No label

Milestone

All milestones No milestones

Project

All projects No project

0 Open 0 Closed

Close

Label

Clear labels

Milestone

No milestone

Projects

Clear projects