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Package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD.

• Vertex 4.023967e+000 2.304217e+000 -1.681500e-003 facet.
• Kicad-footprint-generator Tantalum Capacitor SMD.
• 5.7853 4.29641 7.81019 facet.
• -3.03604 -4.44467 21.8214 vertex -5.51437 -1.05741.
• Inductor 8x8.15mm, https://www.bourns.com/docs/Product-Datasheets/SRN8040.pdf Bourns SRN8040 series.

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