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CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 494, 3.3x3.38mm, 49 Ball.

• -0.479365 0.871967 0.0994153 facet normal -0.392534 -0.665275.
• 162.85 122.845 (end 163.5 112.6525 (end 165.13 111.97.
• B.Cu" "Notes": "Layer B.Cu" "Notes.

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