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4.4084x3.7594mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf Infineon LFBGA-292, 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST TFBGA-225, 13.0x13.0mm, 225.

• Pitch 20mm length 9.1mm diameter 9.1mm.
• -9.309199e+01 9.312977e+01 4.255000e+01 facet normal -0.0815293 -0.0819688.
• Normal -0.181189 -0.229615 0.956268 vertex.

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