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Piano, row spacing 7.62 mm (300 mils 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 6x-dip-switch SPST , Piano, row spacing 25.4 mm (1000 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil SMDSocket SmallPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of 8-Lead Plastic Dual Flat No Lead Package (MF) - 6x5 mm Body [HTSSOP], with thermal vias in pads, 6 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-123-02-xxx-DV-A, 23 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/), generated with kicad-footprint-generator ipc_noLead_generator.py USON, 6 Pin (http://www.nve.com/Downloads/ab3.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP28: plastic thin shrink small outline package; 24 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf VSSOP-8 2.3x2mm Pitch 0.5mm right angle stacked dual USB 3.0, type A, right angle Molex 0.50mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0040, 4 Circuits (https://www.molex.com/pdm_docs/sd/2005280040_sd.pdf), generated with kicad-footprint-generator Harwin Male Horizontal Surface Mount Single Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-89018xx, 18 Pins (http://www.molex.com/pdm_docs/sd/908140004_sd.pdf), generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-60DS-0.5V, 60 Pins per row (http://www.molex.com/pdm_docs/sd/530480210_sd.pdf), generated with kicad-footprint-generator Soldered wire connection, for 6 times 0.15 mm² wires, reinforced.

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