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Font=font); } module mounting_hole_m3(h=thickness, flange=8, style="nut"){ cube([flange, flange, h], center=true); if (Pointer2==1 cube([8, 3, KnobHeight], center=true); if (RingWidth>0 cylinder(r1=KnobMajorRadius + RingWidth, r2=KnobMinorRadius, h=RingThickness, $fn=50, center=true); if (Pointer2==1 cube([8, 3, KnobHeight], center=true); if (style == "nut"){ // a hexagonal cutout (undersize to melt an m3 heat-set insert //hole(s) for anchor // visual indicator of space pot body takes up } module eurorackMountHoles(php, holes, hw module eurorackMountHolesTopRow(php, hw, holes } module x4_7seg_14_22mm_display() { cube([50.5, 19.25, thickness]); Binary files /dev/null and b/3D Printing/Panels/AD&D 1e spell names in Filmoscope Quentin/Panels/MIRROR IMAGE.png differ Binary files /dev/null and b/3D Printing/Panels/HOLD PORTAL.png and /dev/null differ From 2dd0b8c0c736720a0b064bbe1304dc9562beb260 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Add splits and labels to get 1:1 between schematic and PCB, no warnings d62e7c6861 More work finding space for a single 0.75 mm² wires, reinforced insulation, conductor diameter 0.65mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator JST ZE series connector, B12B-PUDSS (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator JST ZE series connector, LY20-26P-DLT1, 13 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ103130.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 16-Lead Ultra Thin Plastic Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic DFN (4mm x 3mm) (see Linear Technology 05081707_A_DHD16.pdf DH Package; 16-Lead Plastic DFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (2mm x 2mm) (see Linear Technology DFN_10_05-08-1722.pdf DFN, 10 Pin (www.allegromicro.com/~/media/Files/Datasheets/A4952-3-Datasheet.ashx?la=en#page=10), generated with kicad-footprint-generator ipc_gullwing_generator.py MultiPowerSO-30 3EP 16.0x17.2mm Pitch 1mm ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7266p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm.

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