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TO-220-4 Vertical RM 1.7mm Pentawatt Multiwatt-5 staggered type-1 TO-220F-5, Vertical, RM 2.54mm, see https://www.diodes.com/assets/Package-Files/TO126.pdf TO-126-2 Vertical RM 3.81mm TO-264-5, Vertical, RM 1.7mm, Pentawatt, Multiwatt-5, staggered type-2, see http://www.ti.com/lit/ds/symlink/lm3886.pdf TO-220F-11 Vertical RM 2.54mm TO-220-4, Horizontal, RM 2.54mm, staggered type-2 TO-220F-15, Vertical, RM 10.9mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-3 Horizontal RM 2.29mm IPAK TO-262-3, Horizontal, RM 0.97mm, Multiwatt-9, staggered type-2 TO-220-5, Horizontal, RM 2.54mm TO-220F-4, Horizontal, RM 1.7mm, staggered type-1, see http://www.ti.com/lit/ds/symlink/lmd18200.pdf TO-220-15, Vertical, RM 2.54mm, staggered type-1 TO-220-9, Horizontal, RM 5.475mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-2 Horizontal RM 5.45mm TO-247-3, Vertical, RM 5.45mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-3 Vertical RM 1.7mm Pentawatt Multiwatt-5 staggered type-2 TO-220-9 Vertical RM 2.54mm IIPAK I2PAK TO-262-5, Horizontal, RM 10.9mm, see https://diotec.com/tl_files/diotec/files/pdf/datasheets/pb1000.pdf Single phase bridge rectifier case KBPC6, see http://www.vishay.com/docs/93585/vs-kbpc1series.pdf Vishay KBM rectifier diode bridge OnSemi SDIP-4L, see https://www.onsemi.com/pdf/datasheet/df10s1-d.pdf OnSemi Diode Bridge SDIP-4L SMD diode bridge Vishay KBL rectifier diode bridge Thermal enhanced ultra thin SMD package; 3 leads; body: 4.3x6.1x0.43mm, https://www.vishay.com/docs/95570/to-277asmpc.pdf 3-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_8_05-08-1637.pdf Texas Instrument DRT-3 1x0.8mm Pitch 0.7mm Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l412t8.pdf ST WLCSP-49, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l412t8.pdf ST WLCSP-49, ST die ID 461, 4.63x4.15mm, 115 Ball.

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