Labels Milestones
BackTo holes - these gaps reduce heat conduction during soldering ground plane Binary files /dev/null and b/VCO_MANUAL_v2.pdf differ 500k Trimpot; tune to 1V.
- SSOP28: plastic shrink small outline package.
- = array Panels/Font files/Quentincaps.ttf.
- [PATCH] Submodules, improved NPTH Hardware/lib/Kosmo_panel.