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Power Integration Y Package SIPAK, Horizontal, RM 2.54mm, see http://www.st.com/resource/en/datasheet/stp20nm60.pdf TO-220F-3 Vertical RM 1.7mm IIPAK I2PAK TO-262-5, Vertical, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Vertical RM 5.45mm TO-3PB-3, Vertical, RM 1.7mm, PentawattF-, MultiwattF-5, staggered type-1 TO-220F-7 Vertical RM 5.08mm TO-220-2, Vertical, RM 1.7mm, IIPAK, I2PAK, see http://www.onsemi.com/pub/Collateral/EN8586-D.PDF TO-262-3 Horizontal RM 4.58mm IPAK TO-251-3, Vertical, RM 0.9mm, staggered type-1 TO-220F-5, Vertical, RM 1.7mm, staggered type-2, see http://www.ti.com/lit/ds/symlink/lm3886.pdf TO-220F-11 Vertical RM 1.27mm staggered type-1 TO-220F-5 Vertical RM 2.286mm SIPAK Horizontal RM 1.7mm staggered type-1 TO-220-11, Vertical, RM 2.54mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-2 Horizontal RM 2.54mm TO-220-3, Vertical, RM 0.97mm, Multiwatt-9, staggered type-2 TO-220-7 Vertical RM 2.54mm TO-220-3, Vertical, RM 3.81mm, see https://www.onsemi.com/pub/Collateral/NJL3281D-D.PDF TO-264-5 Vertical RM 1.27mm staggered type-1 TO-220-11, Horizontal, RM 2.54mm, staggered type-2, see https://www.njr.com/semicon/PDF/package/TO-220F-4_E.pdf TO-220F-4 Vertical RM 4.58mm IPAK TO-251-2, Vertical, RM 1.7mm, PentawattF-, MultiwattF-5, staggered type-1 TO-220-4 Vertical RM 5.45mm TO-3PB-3, Vertical, RM 1.7mm, staggered type-2, see http://www.ti.com/lit/ds/symlink/lm3886.pdf TO-220F-11 Vertical RM 0.9mm staggered type-2 TO-220-11, Horizontal, RM 10.95mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-3 Vertical RM 5.45mm TO-247-4, Horizontal, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220-4 Vertical RM 1.7mm IIPAK I2PAK TO-264-2, Horizontal, RM 1.7mm, PentawattF-, MultiwattF-5, staggered type-1 TO-247-2, Horizontal, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 22.86mm 900mil Socket 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 8x-dip-switch SPST CTS_Series194-8MSTN, Piano, row spacing 7.62 mm (300 mils), Socket, LongPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 18-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 42-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 20-lead surface-mounted.

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