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Socket 32-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 22-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 8-lead surface-mounted (SMD) DIP package, row spacing 11.43 mm (450 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package.

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