Labels Milestones

Back

Die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, DSBGA-6, 0.704x1.054mm, NSMD, YKA pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, off-center ball grid, ST die ID 456, 1.94x2.4mm.

• 1.458075e-15 1.388642e-15 -1.000000e+00 facet normal.
• /VCA/commit/d952ec97f3d5e1172c33dcefe438ee5d18f8d87d" rel="nofollow">d952ec97f3d5e1172c33dcefe438ee5d18f8d87d Start of.
• -4.304039e+000 3.298120e+000 2.480400e+001 facet normal 5.555843e-01.

New Pull Request

0 Open 0 Closed

Label

Show archived labels

Use alt + click/enter to exclude labels

All labels No label

Milestone

All milestones No milestones

Project

All projects No project

0 Open 0 Closed

Close

Label

Clear labels

Milestone

No milestone

Projects

Clear projects