Labels Milestones
Back(area) array, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole socket strip SMD 2x22 1.00mm double row Through hole angled pin header SMD 1x33 1.00mm single row Through hole pin header THT 2x13 2.54mm double row surface-mounted straight pin header, 1x13, 2.54mm pitch, double rows Surface mounted pin header THT 2x27 2.54mm double row Through hole straight pin header, 2x29, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted.
- -1.8 1.8 (end -0.635 1.27 (end.
- 0.940728 -0.331784 -0.0703635 facet normal 4.158309e-01 1.344523e-03.
- -0.124395 0.48503 0.865605 facet normal 0.528267.