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(http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=39), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1030, 10 Pins (http://www.molex.com/pdm_docs/sd/559350210_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SSOP18: plastic shrink small outline package; 40 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf HTSSOP, 38 Pin (JEDEC MO-194 Var BB https://www.jedec.org/document_search?search_api_views_fulltext=MO-194), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Straight solder pin 1 x 1 mm, 734-132 , 2 pins, http://www.kingbright.com/attachments/file/psearch/000/00/00/L-2774GD(Ver.7B).pdf LED_Rectangular Rectangular Rectangular size 5.0x2.0mm^2 3 pins LED diameter 5.0mm z-position of LED center 6.0mm 2 pins Ceramic Resomator/Filter 7.0x2.5mm^2, length*width=7.0x2.5mm^2 package, package length=8.0mm, package width=3.5mm, 3 pins IR-LED, diameter 3.0mm, 2 pins LED_Rectangular, Rectangular, Rectangular size 4.5x1.6mm^2 2 pins LED_Rectangular, Rectangular, Rectangular size 5.0x2.0mm^2 z-position of LED center 3.0mm 2 pins diameter 5.0mm z-position of LED center 2.0mm 2 pins LED_Rectangular Rectangular Rectangular size 5.0x2.0mm^2.

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