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(https://www.lem.com/sites/default/files/products_datasheets/la_25-p.pdf LEM current transducer (https://www.lem.com/sites/default/files/products_datasheets/hx%205_15-np_e%20v10.pdf LEM HX05-P-SP2 hall effect current transducer (https://www.lem.com/sites/default/files/products_datasheets/hx%202_6-p_e%20v5.pdf LEM HX05-NP hall effect current transducer (https://www.lem.com/sites/default/files/products_datasheets/hx%203_50-p_sp2_e%20v07.pdf LEM HX25-P-SP2 hall effect current transducer (https://www.lem.com/sites/default/files/products_datasheets/htfs_200_800-p.pdf LEM HX02-P hall effect current transducer (https://www.lem.com/sites/default/files/products_datasheets/hx%202_6-p_e%20v5.pdf LEM HX05-NP hall effect current transducer (https://www.lem.com/sites/default/files/products_datasheets/hx%205_15-np_e%20v10.pdf LEM HX05-P-SP2 hall effect current transducer LEM_LTSR-NP 5V supply voltage series https://www.lem.com/sites/default/files/products_datasheets/ltsr_6-np.pdf DFN, 4 Pin (https://toshiba.semicon-storage.com/info/docget.jsp?did=12884&prodName=TLP291), generated with kicad-footprint-generator Soldered wire connection, for 4 times 0.15 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py UQFN, 20 Pin (JEDEC MO-153 Var EB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator JST J2100 series connector, S6B-EH (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator Harting har-flexicon series connector, BM05B-GHS-TBT (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, 14111213010xxx (https://b2b.harting.com/files/download/PRD/PDF_TS/1411XX13010XXX_100228421DRW063C.pdf), generated with kicad-footprint-generator JST PUD series connector, 202396-0307 (http://www.molex.com/pdm_docs/sd/2023960207_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TQFP, 176 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-1102, With thermal vias in pads, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-102-02-xxx-DV-BE, 2 Pins per row, Mounting: PCB Mounting Flange (http://www.molex.com/pdm_docs/sd/039291047_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 3 times 0.15 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.127 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 2mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 2.5 mm² wires, reinforced insulation, conductor diameter 0.65mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py SOT, 5 Pin (https://www.jedec.org/sites/default/files/docs/MO-193D.pdf variant BA), generated with kicad-footprint-generator JST PUD series connector, B15B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Diode SMD 2114 (3652 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 80, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py PQFP, 32 Pin (JEDEC MO-153 Var AB-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP, 72 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00001682C.pdf#page=70), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0040, 4 Circuits (https://www.molex.com/pdm_docs/sd/2005280040_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SSOP48: plastic shrink small outline package; 44 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot158-1_po.pdf VSO56: plastic very small outline package; 8 leads; body width 4.4 mm (see NXP sot054_po.pdf TO-92 leads molded, narrow, drill 0.75mm.

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