Labels Milestones
BackRAK811 LPWAN Module https://downloads.rakwireless.com/LoRa/RAK4200/Hardware-Specification/RAK4200_Module_Specifications_V1.4.pdf Class 2 Bluetooth Module with on-board components PCB initial layout, no traces Using the Precision ADSR build notes The build is pretty straightforward except for mechanical assembly, and two other things: Latest commits for file Datasheets/2N3903-Motorola.pdf # Autorouter files (exported from Eeschema) *.net # Autorouter files (exported from Eeschema *.csv *.lck ########################## # Additional ignored # KiCad backups folders *-backups # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes: ============================================================= From a22bca6d29ddc0a54597dab4d11ad9ab7e48e3c6 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Change op amp, dims to user drawings Add comments and graphics symbols to schematics Merge pull request 'Fix rail clearance issues, add PCB slot, more options for.
New Pull Request