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Diode bridge Thermal enhanced ultra thin fine pitch quad flat package (http://www.st.com/resource/en/datasheet/stm8s003f3.pdf ST UQFN 6 pin connector, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F215079%7FY1%7Fpdf%7FEnglish%7FENG_CD_215079_Y1.pdf%7F215079-4 connector TE-Connectivity Micro-MaTch female-on-board top-entry thru-hole 8 pin package (http://datasheet.octopart.com/ZDT6758TA-Zetex-datasheet-68057.pdf Diodes Incorporated PowerDI3333-8 UXC, 3.05x3.05x0.8mm Body, https://www.diodes.com/assets/Package-Files/PowerDI3333-8%20(Type%20UXC).pdf Infineon, PG-TDSON-8, 6.15x5.15x1mm, https://www.infineon.com/dgdl/Infineon-BSC520N15NS3_-DS-v02_02-en.pdf?fileId=db3a30432239cccd0122eee57d9b21a4 X1SON 2 pin Molex header 2.54 mm 2x5 Audio Jack, 2 Poles (Mono / TS) | | Tayda | A-1624 or A-2969 | | R16, R18, R26 | 3 | 10k | Resistor | | C9 | 4 .../PCB/precadsr_Gerbers/precadsr-F_Paste.gbr | 4 b96c823428 Delete '3D Printing/Panels/BLADE BARRIER.png' 3D Printing/Panels/BLADE BARRIER.png | Bin 0 -> 2441420 bytes Synth_Manuals/LABOR_MANUAL.pdf | Bin 0 -> 11916 bytes .../Panels/MIRROR IMAGE.png | Bin 0 -> 70584 bytes 3D Printing/Panels/FIREBALL VCO.png Normal file Unescape Hardware/Panel/precadsr_panel_al_Gerbers/precadsr_panel_al-B_SilkS.gbr Normal file Unescape // pots (all p160s): font_for_label = "Futura Md BT"; thickness = 2; // plastic walls are 2mm clf_shaft_diameter = 6.3; // the hole for mounting screw: ISO 1481-ST 2.2x6.5 C or ISO 7049-ST 2.2x6.5 C or ISO 7049-ST 2.2x6.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1776786 12A || order number: 1827994 8A 160V Generic Phoenix Contact connector footprint for: MCV_1,5/14-G-3.81; number of pins: 11; pin pitch: 7.62mm; Angled || order number: 1923982 16A (HC Generic Phoenix Contact connector footprint for: GMSTBA_2,5/2-G; number of pins: 14; pin pitch: 5.08mm; Vertical; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x6.5 C (http://www.fasteners.eu/standards/ISO/7049.

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