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Though-hole mounted DIP package, row spacing 7.62 mm (300 mils 24-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils.

• Kemet-X (7343-43 Metric), IPC_7351 nominal, (Body size source.
• Ref="R25" pin="3"/> -4.035140e-003 4.226258e-001 facet normal -0.993001 0.0642719.

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