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Pitch 6.35mm, hole diameter 1.3mm, hole diameter 1.3mm, wire diameter 0.5mm test point SMD pad rectangle square SMD pads Net tie, 4 pin, 0.3mm round THT pads Net tie, 4 pin, 1.0mm round THT pads Net tie, 2 pin, 0.5mm square SMD rectangular pad as test Point, square 2.0mm_Drill1.0mm side length, hole diameter 1.4mm wire loop as test Point, diameter 1.5mm THT pad rectangle square THT rectangular pad as test Point, square 1.5mm side length SMD pad as test Point, diameter 4.0mm Plated Hole as test Point, square 3.0mm side length, hole diameter 1.2mm THT rectangular pad as test Point, diameter 3.0mm z-position of LED center 1.0mm, 2 pins, diameter 5.0mm z-position of LED center 2.0mm, 2 pins LED, Round, FlatTop, diameter 3.0mm, 2 pins, diameter 1.8mm size 1.8x2.4mm^2 z-position of LED center 1.0mm 2 pins Rectangular size 5.0x2.0mm^2 z-position of LED center 1.0mm 2 pins LED diameter 3.0mm 2 pins Rectangular size 5.0x2.0mm^2 z-position of LED center 3.0mm 3 pins Ceramic Resomator/Filter 6.0x3.0mm^2, length*width=6.0x3.0mm^2 package, package length=7.0mm, package width=2.5mm, 3 pins THT ceramic resonator filter SMD Resomator/Filter Murata CSTLSxxxG, http://www.murata.com/~/media/webrenewal/support/library/catalog/products/timingdevice/ceralock/p17e.ashx, length*width=8.0x3.0mm^2 package, package length=8.0mm, package width=3.5mm, 3 pins UFQFPN 20-lead, 3 x 3 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package (http://www.st.com/resource/en/datasheet/stm8s003f3.pdf ST UQFN 6 pin 0.5mm Pitch http://www.st.com/resource/en/datasheet/ecmf02-2amx6.pdf UQFN DFN 0.5 ST 20-Lead Plastic Quad Flat, No Lead Package (MA) - 2x2x0.9 mm Body [TQFP] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 24 leads; body width 4.4 mm.

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