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- 16x16x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad 3x2mm Pitch 0.5mm vertical Molex KK 396 Interconnect System, old/engineering part number: A-41791-0018 example for new part number: 26-60-5060, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf.

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