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Ipc_gullwing_generator.py SSOP24: plastic shrink small outline package; 24 leads; body width 4.4 mm; (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 5.45mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-2 Horizontal RM 10.9mm TO-264-3, Horizontal, RM 2.29mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-3 Horizontal RM 10.9mm TO-247-2, Vertical, RM 2.54mm, see https://www.diodes.com/assets/Package-Files/TO126.pdf TO-126-3 Horizontal RM 1.7mm staggered type-1 TO-220F-15 Vertical RM 2.54mm TO-247-4, Vertical, RM 5.45mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-2 Vertical RM 1.27mm Multiwatt-7 staggered type-1 TO-220-9 Horizontal RM 5.45mm TO-3PB-3, Vertical, RM 5.08mm, see http://www.onsemi.com/pub/Collateral/FFPF10F150S-D.pdf TO-220F-2 Horizontal RM 1.27mm Multiwatt-7 staggered type-1 TO-220F-2, Horizontal, RM 5.08mm, see https://www.centralsemi.com/PDFS/CASE/TO-220-2PD.PDF TO-220-2 Horizontal RM 2.54mm IIPAK I2PAK TO-262-5, Horizontal, RM 2.54mm TO-220F-5, Horizontal, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 5.08mm 7.62mm 300mil 8-lead dip package, row spacing 7.62 mm (300 mils 20-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 16-lead surface-mounted.

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