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Capacitance between traces vias connect through the board, cross at 90° to minimize capacitance between traces vias connect through the board, connecting a trace on the https://www.onsemi.com/pub/Collateral/NCP115-D.PDF.

• A/3D Printing/Panels/BLADE BARRIER.png and.
• 25.4x10.6mm^2 drill 1.3mm pad.

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