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Ball, 7x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, http://www.latticesemi.com/view_document?document_id=213 Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf LFCSP 8pin Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments BGA-289, 0.4mm pad, based on the thru-holes. - Move any UX connections on the 16-pin connectors, consider incorporating additional LED indicators for use as tremolo - Manual one-step-forward via momentary push button. CV out, with probably +12v gates. Variable step count, 1-10 steps possible (with 2-3 extra switch positions to re-use for frequently-swapped positions). External reset via socket. External reset via socket. .

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