Labels Milestones
Back| Vendor | SKU | | | | S3 | 1 | Conn_01x02 | SIP socket, 2.54 mm, 1x2 (see [build notes](build.md)) | | | | | | Tayda | A-4349 | | | | | Screws, nuts, and spacers (see build notes) 1 SIP socket, 2.54 mm, 1x2 (see build notes) 1 SIP socket, 2.54 mm, 1x4 Light emitting diode | | | R3, R7 | 2 | 1 | TL074 | Quad Low-Noise JFET-Input Operational Amplifiers, DIP-8/SOIC-8/TSSOP-8/VSSOP-8 Binary files a/Schematics/SEQ_MANUAL_v2.pdf and b/Schematics/SEQ_MANUAL_v2.pdf differ From ef3a1f8c03719dbc0f150781ee9810f0ed7b4301 Mon Sep 17 00:00:00 2001 Subject: [PATCH] adds front panel candidates v1 and v2
Added schmancy pcb for v1 front panel 82024e96c9 updated C14 footprint, traces, groundplane updated C5 footprint & tracing; schematic annotation 2cbdb94ba94f485ce4abcb1f14e2e5f15d016647 updates the potentiometer pads and thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Thin Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Thin Shrink Small Outline (SO), see https://www.elpro.org/de/index.php?controller=attachment&id_attachment=339 SO, 4 Pin (https://toshiba.semicon-storage.com/info/docget.jsp?did=12884&prodName=TLP291), generated with kicad-footprint-generator Molex Pico-Clasp series connector, S2B-EH (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 5569-22A1, example for new.- 1.84181 8.06952 19.9688 facet normal -0.0702523.
- 2sqmm strain-relief Soldered wire.
- Relay package http://omronfs.omron.com/en_US/ecb/products/pdf/en-g6k.pdf Omron G6K-2G relay package http://omronfs.omron.com/en_US/ecb/products/pdf/en-g6k.pdf.