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YZT, 1.86x1.36mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic Small Outline (SS)-5.30 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf UQFN, 16 Pin (http://cds.linear.com/docs/en/datasheet/37551fd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 36 Pin (JEDEC MO-153 Var FF https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 43045-1000 (alternative finishes: 43045-040x), 2 Pins per row (http://www.molex.com/pdm_docs/sd/428192214_sd.pdf), generated with kicad-footprint-generator JST SH series.

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