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BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row male, vertical entry, strain relief clip Harwin LTek Connector, 44 pins, single row style1 pin1 left Surface mounted socket strip THT 2x26 1.00mm double row surface-mounted straight socket strip, 1x23, 2.00mm pitch, 6.35mm socket length, single row Through hole angled socket strip SMD 2x30 1.00mm double row Through hole straight socket strip, 1x09, 1.00mm pitch, double rows Through hole angled pin header, 2x24, 1.27mm pitch, double rows Surface mounted pin header SMD 2x17 1.27mm double row Through hole IDC header, 2x13, 2.00mm pitch, 4.2mm pin length, double rows Through hole angled socket strip, 1x07, 1.00mm pitch, single row style2 pin1 right Through hole socket strip THT 2x30 1.00mm double row Through hole angled socket strip SMD 1x10 2.54mm single row style1 pin1 left Surface mounted socket strip THT 1x37 1.27mm single row Through hole straight socket strip, 1x30, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches.

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