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Ball, 6x6 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 479, 3.56x3.52mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A BGA 1156 1 FF1157.

• 1.05954 7.19679 7.81812 facet normal 2.498245e-001 4.371932e-001.
• -0.995184 -0.0980238 0 vertex -6.36396.
• -4.72589 -5.62591 7.07423 vertex 5.54018 4.83492 6.98312.
• 6.7142 0.75193 19.8418 facet normal 0.989314.

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