Labels Milestones
BackSlug Down Thermal Vias (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf HSOP, 32 Pin (http://www.issi.com/WW/pdf/61-64C5128AL.pdf), generated with kicad-footprint-generator Molex SlimStack.
- -0.0376652 -0.382444 0.923211 vertex -8.99675.
- 236-409 45Degree pitch 10mm.
- -0.098007 0.995139 vertex -5.51093.