3
1
Back

Wide, 5.3 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf DFN package size 11.5x8.5x17.5mm^3, https://www.recom-power.com/pdf/Innoline/R-78HBxx-0.5_L.pdf DCDC-Converter, RECOM, RECOM_R-78HB-0.5L, SIP-3, Horizontally Mounted, pitch 2.54mm, hole diameter 1.2mm, length 11.3mm, width 3.0mm solder Pin_ diameter 1.0mm, hole diameter 1.5mm wire loop as test Point, square 2.0mm side length SMD pad as test Point, square 1.0mm side length SMD rectangular pad as test Point, diameter 4.0mm, 2 pins, pitch 7.5mm, size 39.8x14mm^2, drill diamater 1.15mm, pad diameter 3mm, see , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT single screw terminal block connector http://www.phoenixcontact.com/us/products/1814702/pdf PhoenixContact PTSM0.5 2 2.5mm vertical SMD spring clamp terminal block Metz Connect Type171_RT13706HBWC, 6 pins, pitch 5.08mm, size 15.2x8.45mm^2, drill diamater 1.1mm, pad diameter 2.6mm, see http://www.farnell.com/datasheets/100425.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block Metz Connect Type011_RT05506HBWC pitch 5mm size 6.5x15mm^2 drill 1.2mm pad.

New Pull Request