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Pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition Appendix A Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row Through hole angled socket strip SMD 1x04 1.00mm single row (from Kicad 4.0.7), script generated Through hole IDC header, 2x05, 1.27mm pitch, double rows Through hole angled pin header, 1x04, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled socket strip, 2x09, 2.00mm pitch, 6.35mm socket length, double rows Surface mounted pin header SMD 1x21 2.00mm single row style2 pin1 right Through hole vertical IDC box header, 2x06, 2.54mm pitch, double rows Surface mounted pin header SMD 1x16 2.54mm single row Surface mounted socket strip SMD 1x35 1.27mm single row style1 pin1 left Surface mounted socket strip THT 2x06 2.54mm double row Through hole angled pin header THT 2x13 2.00mm double row surface-mounted straight socket strip, 1x34, 2.54mm pitch, double.

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