Labels Milestones
BackDSBGA, 1.43x1.41mm, 8 bump 2x4 (perimeter) array, NSMD pad definition Appendix A BGA 484 1 FG484 FGG484 Artix-7 BGA, 18x18 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 14x14 grid, 8x8mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15.
- 6.451590e-01 3.338815e-04 vertex -1.032505e+02 1.030635e+02 1.055000e+01.
- Phoenix MKDS-1,5-9 pitch 5mm size 21.5x15mm^2 drill.
- POE, https://productfinder.pulseeng.com/doc_type/WEB301/doc_num/J432/doc_part/J432.pdf RJ45 8p8c quad ethernet.
- Strip, HLE-128-02-xx-DV-TE, 28 Pins per row, Mounting: Snap-in.