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S2-KS/LS/US, http://www.iqdfrequencyproducts.com/products/details/iqxo-70-11-30.pdf, 7.3x5.1mm^2 package Miniature Crystal Clock Oscillator IQXO-70, http://www.iqdfrequencyproducts.com/products/details/iqxo-70-11-30.pdf, 7.5x5.0mm^2 package crystal Ceramic Resin Sealed SMD http://www.foxonline.com/pdfs/fe.pdf, 7.5x5.0mm^2 package crystal Epson Toyocom FA-238 series http://www.mouser.com/ds/2/137/1721499-465440.pdf, hand-soldering, 3.2x2.5mm^2 package SMD Crystal Seiko Epson MC-506 http://media.digikey.com/pdf/Data%20Sheets/Epson%20PDFs/MA-505,506.pdf, 12.7x5.1mm^2 package SMD Crystal Oscillator Seiko Epson SG-8002JA https://support.epson.biz/td/api/doc_check.php?mode=dl&lang=en&Parts=SG-8002DC, 14.0x8.7mm^2 package SMD Crystal Oscillator Seiko Epson SG-8002JC https://support.epson.biz/td/api/doc_check.php?mode=dl&lang=en&Parts=SG-8002DC, hand-soldering, 14.0x8.7mm^2 package SMD Crystal EuroQuartz MQ series http://cdn-reichelt.de/documents/datenblatt/B400/MQ.pdf, 7.0x5.0mm^2 package SMD Crystal Oscillator IDT https://www.idt.com/document/dst/xu-family-datasheet#page=17, 7.0x5.0mm IQD Crystal Clock Oscillator Abracon ASV series, http://www.abracon.com/Oscillators/ASV.pdf, hand-soldering, 7.0x5.1mm^2 package FN Series Crystal Clock Oscillator EuroQuartz XO53 series, http://cdn-reichelt.de/documents/datenblatt/B400/XO53.pdf, hand-soldering, 5.0x3.2mm^2 package 14-lead dip package, row spacing 7.62 mm (300 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 8-lead surface-mounted (SMD) DIP package, row spacing 5.25 mm (206 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 6x-dip-switch SPST KingTek_DSHP06TJ, Slide, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP SMDIP 2.54mm 9.53mm 375mil 4-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil PowerIntegrations variant of 8-Lead Plastic Dual Flat, No Lead Package (JQ) - 4x4x0.5 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic Small outline http://www.ti.com/lit/ml/mpds158c/mpds158c.pdf VSO40: plastic very small outline package; 48 leads; body width 4.4 mm; Exposed Pad Variation; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline package; 20 leads; body width 16.90 mm Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), body size 6.7x29.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 9x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 9.78x25.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 8x-dip-switch SPST Copal_CHS-08A, Slide, row spacing 15.24 mm (600 mils), Socket 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 32-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 25.4mm 1000mil SMDSocket SmallPads 40-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 6-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 22-pin zero insertion force socket, through-hole, row spacing 15.24 mm (600 mils 48-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 5-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 28-lead though-hole mounted.

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