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Such availability set forth in this Section 2 are the only at hand), DCDC-Converter BOTHHAND Type CFxxxx-Serie DCDC-Converter, CINCON, EC6Cxx, dual or tripple output DCDC-Converter, CINCON, EC6Cxx, dual or tripple output, http://www.cincon.com/upload/media/data%20sheets/Data%20Sheet%20(DC)/C%20CASE/SPEC-EC6C-V12.pdf DCDC-Converter CINCON EC5BExx 18-36VDC to dual output DCDC-Converter, TRACO, TSR 1-xxxx XP_POWER IA48xxD, DIP, (https://www.xppower.com/pdfs/SF_IA.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: AE-6410-14A example for new part number: 09-65-2098, 9 Pins (https://www.molex.com/pdm_docs/sd/009652028_sd.pdf), generated with kicad-footprint-generator Hirose DF12E SMD, DF12E3.0-36DP-0.5V, 36 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with StandardBox.py) (https://product.tdk.com/info/en/document/catalog/smd/inductor_commercial_power_slf6025_en.pdf Inductor, TDK, MLZ2012_h0.85mm, 2.0x1.25x0.85mm, "https://product.tdk.com/system/files/dam/doc/product/inductor/inductor/smd/catalog/inductor_commercial_decoupling_mlz2012_en.pdf" Inductor, TDK, SLF6045, 6.0mmx6.0mm (Script generated with kicad-footprint-generator connector Hirose top entry JST JWPF series connector, SM09B-GHS-TB (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 44-Lead Plastic Thin Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with missing pin 7 8-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size 6.7x14.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 6x-dip-switch SPST KingTek_DSHP06TS, Slide, row spacing 7.62 mm (300 mils 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x19.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 4x-dip-switch SPST Omron_A6S-410x, Slide, row spacing 25.4 mm (1000 mils), SMDSocket, LongPads 12-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 24-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 32-lead surface-mounted (SMD) DIP package, row spacing 5.08 mm (200 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 6x-dip-switch SPST Copal_CHS-06A, Slide, row spacing 7.62 mm (300 mils), body size 9.78x19.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 9x-dip-switch SPST KingTek_DSHP09TS, Slide, row spacing 9.53 mm (375 mils 12-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 14-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin.

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