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In storage; decipher key matrix, work out either MC or dumb resistor array to output correct volts for each stage? * TBD, needs testing; but if LEDs are possible, this should be possible, too * See manual step (sw13 // 1 for cv glide atten (rv15 // glide in (sleeve and normal both GND Glide attenuator (B10k) (join two left pins from below Pots, 2-pin: - Glide, manual (A100k) (two left pins, from below) Pots, 2-pin: - Glide, manual (A100k) (two left pins, from below Pots, 2-pin: - Glide, manual (A100k) (two left pins, from below Clock rate (B100k) (not sure yet which 2 pins diameter 1.8mm size 1.8x2.4mm^2 z-position of LED center 1.0mm 2 pins Rectangular size 5.0x2.0mm^2 z-position of LED center 2.0mm, 2 pins, pitch 10mm, size 25x10.3mm^2, drill diamater 1.15mm, pad diameter 2.4mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 28 Pin (https://www.akm.com/akm/en/file/datasheet/AK5394AVS.pdf#page=23), generated with kicad-footprint-generator ipc_noLead_generator.py DFN 8 2x2mm, 0.5mm http://www.qorvo.com/products/d/da000896 DFN 0.5 ST 20-Lead Plastic Quad Flat, No Lead Package - 3x3 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic Dual Flat, No Lead Package - 9x9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 44 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot510-1_po.pdf TSSOP, 44 Pin (JEDEC MO-153 Var FA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-178 , 18.

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