Labels Milestones
BackSurface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils SMD DIP DIL PDIP 2.54mm 25.4mm 1000mil 40-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 32-lead though-hole mounted DIP package, row spacing 8.9 mm.
- See https://standexelectronics.com/de/produkte/ms-reed-relais/ Standex Meder.
- 2.208553e-01 9.753065e-01 -3.470281e-04 vertex -9.599162e+01.