Labels Milestones
BackIpc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g431c6.pdf ST WLCSP-49, ST die ID 479, 3.56x3.52mm, 64 Ball, 8x8.
- 0.0458094 0.920075 0.389053 vertex 7.2327 -0.99264.
- Connector, 505405-0470 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated.