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Connector System, 43045-1021 (alternative finishes: 43045-062x), 3 Pins per row (http://www.molex.com/pdm_docs/sd/530480210_sd.pdf), generated with kicad-footprint-generator JST XA series connector, B12B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Hirose DF63 through hole, DF11-28DP-2DSA, 14 Pins (http://www.molex.com/pdm_docs/sd/559320530_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-130-02-xxx-DV-BE, 30 Pins per row (https://www.molex.com/pdm_docs/sd/022057045_sd.pdf), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FH12-53S-0.5SH, 53 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog&lang=en&documentid=D31688_en), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 53748-0808, 80 Pins (https://www.molex.com/pdm_docs/sd/537480308_sd.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-0103, With thermal vias in pads, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 10-Lead SSOP, 3.9 x 4.9mm body, 1.00mm pitch (http://www.st.com/resource/en/datasheet/viper01.pdf SSOP 3.9 4.9 1.00 SSOP14: plastic shrink small outline package; 14 leads; body width 3.9 mm; lead pitch 0.635; (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 transistor TO-92 2-pin leads in-line, narrow, oval pads, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 18 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline 7,5mm long https://toshiba.semicon-storage.com/info/docget.jsp?did=53548&prodName=TLP2770 6-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline (ST)-4.4 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flatpack (PF) - 14x14mm body, 9.5mm sq thermal pad (http://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf 80-Lead Plastic Thin Quad Flatpack - 10x10x2.5mm Body (http://www.onsemi.com/pub/Collateral/122BK.PDF PQFP80 14x20 / QIP80E CASE 122BS (see ON Semiconductor 506CN.PDF DC8 Package 8-Lead Plastic DFN (5mm x 5mm); (see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-32/CP_32_27.pdf LFCSP, 48 Pin (JEDEC MO-153 Var FD https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Hirose series connector, S03B-XASK-1N-BN (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Hirose series connector, B4B-XH-AM, with boss (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf.

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