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Signal relay, DPDT, double coil latching, https://content.kemet.com/datasheets/KEM_R7002_EC2_EE2.pdf Kemet EC2 signal relay DPDT double dual coil latching through hole 4.5mm, height 1, Wuerth electronics 9774090482 (https://katalog.we-online.de/em/datasheet/9774090482.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-102-02-xxx-DV, 2 Pins per row (http://www.molex.com/pdm_docs/sd/530480210_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for a single 1 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 3.5mm, size 32.2x7mm^2, drill diamater 1.1mm, pad diameter 2.1mm, size source Multi-Contact FLEXI-2V 0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py WQFN, 16 Pin (https://www.st.com/resource/en/datasheet/stp08cp05.pdf#page=20), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-2103, With thermal vias in pads, 6 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator Capacitor SMD AVX-M (7260-20 Metric), IPC_7351 nominal, (Body size source: https://www.nikhef.nl/pub/departments/mt/projects/detectorR_D/dtddice/ERJ2G.pdf), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: 26-60-4150, 15 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole PLCC, 52 pins, through hole 3.2mm, height 3.6, Wuerth electronics 9774040360 (https://katalog.we-online.de/em/datasheet/9774040360.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 9, Wuerth electronics 9774020633 (https://katalog.we-online.com/em/datasheet/9774020633.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, DF52-15S-0.8H (https://www.hirose.com/product/en/products/DF52/DF52-3S-0.8H%2821%29/), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 6 Pin (https://www.diodes.com/assets/Package-Files/U-DFN2018-6.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, 505405-0670 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator Molex Pico-Clasp series connector, B1B-XH-AM, with boss (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 2.5 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 2.7mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 1 mm² wires, basic insulation, conductor diameter 0.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-xV 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.5 mm² wires, basic insulation, conductor diameter 2.4mm, outer diameter 1.7mm, outer diameter 1.5mm, hole diameter 1.0mm THT pad THT pad as test point, pitch 2.54mm, hole diameter 1.85mm wire loop with bead as test Point, diameter 3.0mm.

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