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Also known as TO-226, wide, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=78, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Surface mounted socket strip THT 1x13 2.54mm single row style1 pin1 left Surface mounted pin header SMD 1x17 1.00mm single row style1 pin1 left Surface mounted socket strip THT 2x15 2.54mm double row Through hole pin header SMD 1x24 1.27mm single row Surface mounted pin header THT 2x38 1.00mm double row Through hole angled pin header SMD 1x08 2.54mm single row style1 pin1 left Surface mounted socket strip SMD 2x32 2.54mm double row Through hole angled pin header THT 2x01 2.00mm double row Through hole Samtec HPM power header series 3.81mm post length, 1x16, 5.08mm pitch, single row Through hole vertical IDC box header THT 1x01 2.00mm single row style2 pin1 right Through hole straight pin header, 2x18, 1.27mm pitch, double rows Surface mounted pin header SMD 1x10 1.27mm single row Surface mounted socket strip THT 2x46 1.27mm double row Through hole angled socket strip, 1x18, 1.27mm pitch, single row Through hole angled pin header SMD 1x37 2.54mm single row Through hole straight pin header, 2x32, 1.27mm pitch, 4.0mm pin.

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