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Strip, HLE-127-02-xxx-DV-LC, 27 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Harwin Male Horizontal Surface Mount Single Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-89011xx, 11 Pins per row (https://cdn.harwin.com/pdfs/M20-781.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py UQFN, 48 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0144.PDF), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 9, Wuerth electronics 9775106360 (https://katalog.we-online.com/em/datasheet/9775106360.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 36 Pin (www.st.com/resource/en/datasheet/stm32f101t6.pdf#page=72), generated with kicad-footprint-generator Molex PicoBlade Connector System, 43045-0800 (alternative finishes: 43045-242x), 12 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with kicad-footprint-generator Harting har-flexicon series connector, B09B-ZESK-D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Hirose series connector, DF3EA-11P-2H (https://www.hirose.com/product/document?clcode=CL0543-0332-0-51&productname=DF3EA-5P-2H(51)&series=DF3&documenttype=2DDrawing&lang=en&documentid=0001163317), generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 5566-08A, example for new part number: A-41791-0006 example for new mpn: 39-28-920x, 10 Pins per row (http://www.molex.com/pdm_docs/sd/530480210_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 64-Lead Plastic Thin Quad Flatpack - 10x10x2.5mm Body (http://www.onsemi.com/pub/Collateral/122BK.PDF PQFP80 14x20 / QIP80E CASE 122BS (see ON Semiconductor 506CE.PDF DD Package; 8-Lead Plastic PSOP, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Shrink Small Outline (SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true 6-pin plasic small outline package; 44 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf VSSOP-8 2.3x2mm Pitch 0.5mm Analog Devices (Linear Tech), 133-pin BGA uModule, 15.0x15.0x4.92mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf MAPBGA 9x9x1.11 PKG, 9.0x9.0mm, 272 Ball, 17x17 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wl54jc.pdf ST UFBGA-121, 6.0x6.0mm, 121 Ball, 11x11 Layout, 0.5mm Pitch.

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