Labels Milestones
BackPSOP44: plastic thin shrink small outline package; 24 leads; body width 4.4 mm; thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 932BH.PDF TQFP, 64 Pin (JEDEC MO-153 Var CC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator connector Wuerth WR-WTB.
- MCV_1,5/8-GF-3.5; number of pins: 04; pin pitch.
- 0.102188 facet normal -0.172963 0.0922671 0.980597 vertex 5.0946.
- Looking from below. Clock rate.