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BackWww.st.com/resource/en/application_note/cd00003801.pdf HSOP, 32 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T1655-2)), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 10, Wuerth electronics 9774020951 (https://katalog.we-online.de/em/datasheet/9774020951.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP I, 28 pins, through hole 2.25mm, height 4, Wuerth electronics 9775086360 (https://katalog.we-online.com/em/datasheet/9775086360.pdf), generated with kicad-footprint-generator Hirose DF13C SMD, CL535-0412-6-51, 12 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0230, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: AE-6410-10A example for new mpn: 39-28-x06x, 3 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0694-9-81&productname=DF12C(3.0)-50DS-0.5V(81)&series=DF12&documenttype=2DDrawing&lang=en&documentid=0000994748.
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