3
1
Back

2x11, 1.00mm pitch, 2.0mm pin length, double rows Through hole straight pin header, 2x02, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN 4-Lead Plastic.

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