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3x5 raster, 2.28x3.092mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00257211.pdf WLCSP-64, 8x8 raster, 4.539x4.911mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUK 7 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 1x11 2.00mm single row (from Kicad 4.0.7), script generated Surface mounted pin header SMD 1x26 2.54mm single row Through hole socket strip THT 2x34 2.00mm double row Through hole angled socket strip, 2x10, 1.27mm pitch, 4.0mm pin length, single row style1 pin1 left Surface mounted socket strip THT 2x10 2.54mm double row Through hole angled pin header, 2x10, 2.54mm pitch, 6mm pin length, single row Through hole socket strip THT 1x19 2.54mm single row Through hole angled pin header, 2x32, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 12.0mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled socket strip, 2x28, 2.00mm pitch, 4.2mm.

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