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With 50 contacts (not polarized Highspeed card edge connector for PCB's with 08 contacts (polarized Highspeed card edge connector for 2.4mm PCB's with 50 contacts (not polarized Highspeed card edge connector for 1.6mm PCB's with 08 contacts (not polarized Highspeed card edge connector for 1.6mm PCB's with 60 contacts (polarized Highspeed card edge connector for PCB's with 50 contacts (not polarized Highspeed card edge connector for PCB's with 30 contacts (polarized Highspeed card edge connector for 2.4mm PCB's with 08 contacts (not polarized Highspeed card edge connector for 1.6mm PCB's with 30 contacts (polarized Highspeed card edge card connector socket for 1.57mm PCBs, vertical, alignment pins, weld tabs, board locks (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm BGA-64, 10x10 raster, 4.201x4.663mm package, pitch 0.5mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf UFBGA 132 Pins, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf BGA 12 0.5 R-XBGA-N12 Texas Instruments, DSBGA, area grid, YZR pad definition Appendix A BGA 238 0.5 CP236 CPG236 Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x24, 2.00mm pitch, single row Surface mounted socket strip THT 2x16 2.54mm double row Through hole angled socket strip THT 1x07 2.54mm single row Through hole straight pin header, 2x06, 2.54mm pitch, single row Surface mounted pin header THT 1x05 1.00mm single row style2 pin1 right Through hole pin.

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