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(http://www.ti.com/lit/ds/symlink/tps568215.pdf QFN, 16 Pin package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with missing pin 6 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 2x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 40-pin zero insertion force socket, through-hole, row spacing 5.9 mm (232 mils), body size 6.7x14.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 8x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 4x-dip-switch SPST KingTek_DSHP04TJ, Slide, row spacing 7.62 mm (300 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x11.72mm 4x-dip-switch SPST KingTek_DSHP04TS, Slide, row spacing 15.24 mm (600 mils), LongPads 20-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 14-lead though-hole mounted DIP package, row.

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