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Phoenix MKDS-1,5-2-5.08 pitch 5.08mm size 50.8x9.8mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00073, 8 pins, pitch 5.08mm, size 10.2x8.45mm^2, drill diamater 1.2mm, pad diameter 2mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py 10-Lead SSOP, 3.9 x 4.9mm body, 1.00mm pitch (http://www.st.com/resource/en/datasheet/viper01.pdf SSOP 3.9 4.9 1.00 SSOP14: plastic shrink small outline package; 28 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG SSOP20: plastic shrink small outline package; 44 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 28 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 16 leads; body width 16.90 mm Power-Integrations variant of 8-Lead Plastic Dual Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body [VDFN] (see Microchip datasheet http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf MLF, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/doc8246.pdf#page=264), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Straight solder pin 1 x 1 mm, 734-144 , 14 Pins (http://www.molex.com/pdm_docs/sd/559320210_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP44: plastic thin shrink small outline package http://www.ti.com/lit/ds/symlink/drv8301.pdf HVSSOP, 10 Pin (https://www.ti.com/lit/ds/symlink/tmp461.pdf#page=35 (RUN0010A)), generated with kicad-footprint-generator Samtec HLE .100" Tiger.

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